Elements of Electroplating

① Cathode: The object to be plated refers to various connector terminals.
② Anode: If it is a soluble anode, it is the metal to be plated. In the case of insoluble anodes, most are noble metals (platinum, iridium oxide).
③ Electroplating potion: Electroplating potion containing metal ions to be plated.
④ Electroplating tank: The tank body that can withstand and store the electroplating potion generally considers factors such as strength, corrosion resistance, and temperature resistance.
⑤ Rectifier: A device that provides DC power.
The working conditions of electroplating refer to the operating change factors during electroplating, including: current density, temperature, stirring and waveform of power supply, etc. Various current waveforms can be obtained according to the number of phases of the AC power supply and the rectifier circuit. For example, single-phase half-wave, single-phase full-wave, three-phase half-wave and three-phase full-wave, etc. Practice has proved that the current waveform has an impact on the crystal structure, brightness, dispersion ability and covering ability of the plating solution, alloy composition, additive consumption, etc., so the selection of current waveform should be paid attention to. In addition to using general direct current, periodic commutation current and pulse current can also be used according to actual needs.