10A 10V PCB Rectifier Plating For Naked Layer Copper

In the PCB manufacturing process, electroless copper plating is an important step. It is widely used in the following two processes. One is plating onto bare laminate and the other is plating through hole, because under these two circumstances, electroplating cannot or can hardly be carried out. In the process of plating onto bare laminate, electroless copper plating plates a thin layer of copper on the bare substrate to make the substrate conductive for further electroplating. In the process of plating through hole, electroless copper plating is used to make the inner walls of the hole conductive to connect the printed circuits in different layers or the pins of the integrated chips.

The principle of electroless copper deposition is to use the chemical reaction between a reducing agent and a copper salt in a liquid solution so that the copper ion can be reduced to a copper atom. The reaction should be continuous so that sufficient copper can form a film and cover the substrate.

This series of rectifier is special designed for PCB Naked layer copper plating, adopt small size to optimized the installation space, the low and high current can be controlled by automated switching, the air cooling used independent enclosed air duct, synchronous rectification and energy saving, these features ensure high precision, stable performance and reliability.

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