500A 200V Electroplating Plasma Plating Rectifier

Introducing our cutting-edge Plasma Coating Rectifier — the perfect solution for achieving high-quality plating results with precision and efficiency. Powered by the latest chop cutting technology, this rectifier is designed to elevate your plating processes to new heights.

Key Benefits:
Superior Performance: With a voltage of 200V and a current of 500A, our Plasma Coating Rectifier delivers consistent and reliable performance to ensure impeccable plating outcomes every time.
Advanced Technology: The innovative chop cutting technology sets our rectifier apart, enabling precise control and efficient operation for superior results.
Quality Plating: Designed for high-quality plating applications, our rectifier ensures a flawless finish that meets the highest standards in the industry.
Competitive Pricing: We offer our Plasma Coating Rectifier at a competitive price point, providing exceptional value without compromising on quality.
Experience the difference with our Plasma Coating Rectifier and take your plating processes to the next level. Enhance efficiency, accuracy, and quality in your operations with this state-of-the-art solution.
Elevate your plating capabilities with our Plasma Coating Rectifier — where innovation meets excellence. Order yours today and witness the transformative power of cutting-edge technology in action.
Electroplating is the process of applying a thin layer of other metals or alloys on the surface of certain metals by electrolysis. It is a process of applying a metal film to the surface of metals or other materials to prevent metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance aesthetics.
Types of plating

1. Copper plating: priming, enhance the ability to adhere to the plating layer, and the ability to resist corrosion. (Copper is easy to oxidation, oxidation, copper green no longer conductive, so copper-plated products must do copper protection)
2. Nickel plating: priming or appearance, to enhance the corrosion resistance and wear resistance, (where the chemical nickel for the modern process of wear resistance than chrome plating). (Note that many electronic products, such as DIN head, N head, no longer use nickel priming, mainly because nickel is magnetic, will affect the electrical properties inside the passive intermodulation)
3. Gold plating: improve the conductive contact impedance, enhance signal transmission. （Gold is the most stable, but also the most expensive.)
4. Palladium-nickel plating: improve the conductive contact impedance, enhance signal transmission, wear resistance than gold.
5. Tin-lead plating: improve soldering ability, soon to be replaced by other substitutes (because of the lead content is now mostly changed to bright tin and mist tin plating).
6. Silver plating: improve the conductive contact impedance, improve signal transmission. (Silver performance is the best, easy to oxidation, oxidation also conductive)
   
   
   

Elements of electroplating

1. Cathode: the plated object, referring to various connector terminals.
2. Anode: If it is soluble anode, it is the metal to be plated. If it is insoluble anode, most of them are precious metals (white gold, iridium oxide).
3. Plating solution: plating solution containing ions of the metal to be plated.
4. Plating tank: The tank that can bear and store the plating solution, generally considering strength, corrosion resistance, temperature resistance, etc.
5. Rectifier: The equipment to provide DC power supply.

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